Ankit Kaul

I am a third year PhD student at the Integrated 3D Systems group at Georgia Institute of Technology, where I am advised by Dr. Muhannad S. Bakir. My research interests include modeling of thermal and power delivery effects, and die-to-die signaling in advanced 2.5D and 3D ICs for heterogeneous integration. I received my bachelors in electrical engineering at the R.V. College of Engineering in 2013. I also recieved the JN Tata Endowment for higher education in 2016.

During summer 2020, I was a Ph.D. intern with the Advanced Products, Physical IP group at Arm Inc., where I worked on thermal evaluation of multi-core systems. I was advised by Jim Dodrill and I collaborated with Saurabh Sinha .

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Research and Publications

My PhD research focuses on identifying power delivery, thermal, and signaling challenges in 2.5D and 3D ICs and exploring techniques to mitigate them. I also investigate the impact of 3D integration on emerging non-volatile memory device-based compute in-memory (CIM) inference engine models. For my research, I leverage analytical techniques for system level modeling of heterogeneous integration schemes.

Thermal Modeling of 3D Polylithic Integration and Implications on BEOL RRAM Performance
A. Kaul, X. Peng, S. Kochupurackal Rajan, S. Yu, M. S. Bakir
IEDM, 2020, virtual, invited   (Oral Presentation)

Benchmarking Monolithic 3D Integration for Compute-in-Memory Accelerators: Overcoming ADC Bottlenecks and Maintaining Scalability to 7nm or Beyond
X. Peng, W. Chakraborty, A. Kaul, M. S. Bakir, S. Datta, S. Yu,
IEDM, 2020, virtual

BEOL-Embedded 3D Polylithic Integration: Thermal and Interconnection Considerations
A. Kaul, S. Kochupurackal Rajan, M. Obaidul Hossen, G. S. May, M. S. Bakir
ECTC, 2020   (Oral Presentation)

Microfluidic Cooling of a 14-nm 2.5-D FPGA With 3-D Printed Manifolds for High-Density Computing: Design Considerations, Fabrication, and Electrical Characterization
T. Sarvey, A. Kaul, S. Kochupurackal Rajan, G. S. May, M. S. Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 12, pp. 2393-2403, 2019.

Based on the source code from