During spring 2022, I was an Advanced Packaging intern at AMD, where I worked on pathfinding for the 3D V-cache packaging architecture. I was co-advised by Hemanth Dhavaleswarapu and Rahul Agarwal, and I collaborated with Chandra Mandalapu.
During summer 2020, I was a Ph.D. intern with the Advanced Products, Physical IP group at Arm Inc., where I studied design-time power and thermal optimization of scaled 2.5D and 3D multi-core systems. I was advised by Jim Dodrill and I collaborated with Saurabh Sinha and Rahul Mathur .
My PhD research focuses on the impact of 3D integration on emerging non-volatile memory device-based compute in-memory (CIM) inference engine models. I also study die-to-die signaling, power delivery, and thermal challenges in 2.5D and 3D integration architectures and explore mitigation techniques. For my research, I leverage analytical techniques for system level modeling of heterogeneous integration architectures. For an updated list of publications, please visit my Google Scholar page.
June 2022: I will be presenting my work on "Die-to-die Signaling and Thermal Considerations for 2.5D Integration of Arm-based 7nm High-Performance Systems" as a poster at the 2022 Design Automation Conference on July 13, 2022 at San Francisco, CA.
Outside work, I enjoy biking, running, hiking, and playing badminton. I log my activities to Garmin Connect that syncs to Strava. I would have preferred embeddeding Gramin Connect but have not found a way so far to embed all Connect activities as an iframe, sadly. Always open to a good game of badminton or table tennis!
I aspire to build the perfect long run playlist! Here's what I have so far: