Ankit Kaul

I am a PhD candidate at the Integrated 3D Systems group at the department of Electrical and Computer Engineering at Georgia Institute of Technology, where I am advised by Dr. Muhannad S. Bakir. My research interests include studying design challenges in die-to-die signaling, thermal and power delivery in advanced 2.5D and 3D ICs for heterogeneous integration. I received my bachelors in electrical engineering at the R.V. College of Engineering in 2013. I also recieved the JN Tata Endowment for higher education in 2016.

During spring 2022, I was an Advanced Packaging intern at AMD, where I worked on pathfinding for the 3D V-cache packaging architecture. I was co-advised by Hemanth Dhavaleswarapu and Rahul Agarwal, and I collaborated with Chandra Mandalapu.

During summer 2020, I was a Ph.D. intern with the Advanced Products, Physical IP group at Arm Inc., where I studied design-time power and thermal optimization of scaled 2.5D and 3D multi-core systems. I was advised by Jim Dodrill and I collaborated with Saurabh Sinha and Rahul Mathur .

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Research and Publications

My PhD research focuses on the impact of 3D integration on emerging non-volatile memory device-based compute in-memory (CIM) inference engine models. I also study die-to-die signaling, power delivery, and thermal challenges in 2.5D and 3D integration architectures and explore mitigation techniques. For my research, I leverage analytical techniques for system level modeling of heterogeneous integration architectures. For an updated list of publications, please visit my Google Scholar page.

Heterogeneous 3D Integration of Multi-Tier Compute-in-Memory Accelerators: An Electrical-Thermal Co-Design
X. Peng, A. Kaul, M. S. Bakir, S. Yu
IEEE Transactions on Electron Devices, 2021 (early access)  

Thermal Modeling of 3D Polylithic Integration and Implications on BEOL RRAM Performance
A. Kaul, X. Peng, S. Kochupurackal Rajan, S. Yu, M. S. Bakir
IEDM, 2020, virtual, invited   (Oral Presentation)

Benchmarking Monolithic 3D Integration for Compute-in-Memory Accelerators: Overcoming ADC Bottlenecks and Maintaining Scalability to 7nm or Beyond
X. Peng, W. Chakraborty, A. Kaul, M. S. Bakir, S. Datta, S. Yu,
IEDM, 2020, virtual

BEOL-Embedded 3D Polylithic Integration: Thermal and Interconnection Considerations
A. Kaul, S. Kochupurackal Rajan, M. Obaidul Hossen, G. S. May, M. S. Bakir
ECTC, 2020   (Oral Presentation, Nominated for EPS/ECTC Student Travel Award)

Microfluidic Cooling of a 14-nm 2.5-D FPGA With 3-D Printed Manifolds for High-Density Computing: Design Considerations, Fabrication, and Electrical Characterization
T. Sarvey, A. Kaul, S. Kochupurackal Rajan, G. S. May, M. S. Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 12, pp. 2393-2403, 2019.


June 2022: I will be presenting my work on "Die-to-die Signaling and Thermal Considerations for 2.5D Integration of Arm-based 7nm High-Performance Systems" as a poster at the 2022 Design Automation Conference on July 13, 2022 at San Francisco, CA.

November 17 2021: I presented a paper on "Thermal Reliability Considerations of Resistive Synaptic Devices for 3D CIM System Performance" at the 2021 IEEE International 3D Systems Integration Conference (3DIC) at Raleigh, NC. Paper

October 2021: I am happy to announce that I will be joining AMD Advanced Packaging as a research intern from Jan. - May 2022 at Austin, TX.

August 2021: My work on "3D polylithic integration and thermal implications on BEOL RRAM performance" was featured in the Chip Scale Review: The Future of Semiconductor Packaging magazine, July-August 2021 issue, page 19. Magazine Link

December 13 2020: I presented a paper on "Thermal modeling of 3D polylithic integration and implications on BEOL RRAM performance" at the 2020 IEEE International Electron Devices Meeting (IEDM) at San Francisco, CA. Paper

June 3 2020: I presented a paper on "BEOL-embedded 3D polylithic integration: Thermal and interconnection considerations" at the 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) at Orlando, FL. Paper


Outside work, I enjoy biking, running, hiking, and playing badminton. I log my activities to Garmin Connect that syncs to Strava. I would have preferred embeddeding Gramin Connect but have not found a way so far to embed all Connect activities as an iframe, sadly. Always open to a good game of badminton or table tennis!

I aspire to build the perfect long run playlist! Here's what I have so far:

Based on the source code from