During summer 2020, I was a Ph.D. intern with the Advanced Products, Physical IP group at Arm Inc., where I worked on thermal evaluation of multi-core systems. I was advised by Jim Dodrill and I collaborated with Saurabh Sinha .
My PhD research focuses on identifying power delivery, thermal, and signaling challenges in 2.5D and 3D ICs and exploring techniques to mitigate them. I also investigate the impact of 3D integration on emerging non-volatile memory device-based compute in-memory (CIM) inference engine models. For my research, I leverage analytical techniques for system level modeling of heterogeneous integration schemes.