Ankit Kaul

I am a third year PhD student at the Integrated 3D Systems group at Georgia Institute of Technology, where I am advised by Dr. Muhannad S. Bakir. My research interests include modeling of thermal and power delivery effects, and die-to-die signaling in advanced 2.5D and 3D ICs for heterogeneous integration. I received my bachelors in electrical engineering at the R.V. College of Engineering in 2013. I also recieved the JN Tata Endowment for higher education in 2016.

During summer 2020, I was an intern with the Advanced Products, Physical IP group at Arm Inc., where I worked on thermal evaluation of multi-core systems. I was advised by Jim Dodrill and I collaborated with Saurabh Sinha .

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Research and Publications

My PhD research focuses on identifying power delivery, thermal, and signaling challenges in 2.5D and 3D ICs and exploring techniques to mitigate them. I leverage analytical techniques for system level modeling of heterogeneous integration schemes.

BEOL-Embedded 3D Polylithic Integration: Thermal and Interconnection Considerations
Ankit Kaul, Sreejith Kochupurackal Rajan, Md Obaidul Hossen, Gary S. May, Muhannad S. Bakir
ECTC, 2020   (Oral Presentation)
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Based on the source code from https://jonbarron.info/.